View TSA5522T_886043.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TSA5522 1.4 GHz I2C-bus controlled synthesizer
Product specification Supersedes data of 1995 Mar 22 File under Integrated Circuits, IC02 1996 Jan 23
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
FEATURES * Complete 1.4 GHz single chip system * Three PNP band switch buffers (20 mA) * Four bus-controlled bidirectional ports (NPN open-collector outputs); only one port in 16-pin version * 33 V tuning voltage output * In-lock detector * 5-step ADC * Mixer-Oscillator (M/O) band switch output * 15-bit programmable divider * Programmable reference divider ratio (512, 640 or 1024) * Programmable charge-pump current (50 or 250 A) * Varicap drive disable * I2C-bus format - address plus 4 data bytes transmission (write mode) - address plus 1 status byte transmission (read mode) - three independent addresses * Low power and low radiation. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TSA5522M TSA5522T SSOP20 SO16 DESCRIPTION plastic shrink small outline package; 20 leads; body width 4.4 mm plastic small outline package; 16 leads; body width 3.9 mm APPLICATIONS * TV tuners and front-ends * VCR tuners.
TSA5522
VERSION SOT266-1 SOT109-1
1996 Jan 23
2
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
QUICK REFERENCE DATA SYMBOL VCC1 VCC2 ICC1 ICC2 fRF Vi(RF) PARAMETER supply voltage (+5 V) band switch supply voltage (+12 V) supply current band switch supply current RF input frequency RF input voltage fi = 80 to 150 MHz fi = 150 to 1000 MHz fi = 1000 to 1400 MHz fxtal Io(PNP) Io(NPN) Tamb Tstg Note 1. One band switch buffer ON; Io = 20 mA. GENERAL DESCRIPTION (see Fig.1) The device is a single chip PLL frequency synthesizer designed for TV and VCR tuning systems. The circuit consists of a divide-by-eight prescaler with its own preamplifier, a 15-bit programmable divider, a crystal oscillator and its programmable reference divider and a phase/frequency detector combined with a charge-pump which drives the tuning amplifier, including 33 V output. Three high-current PNP band switch buffers are provided for band switching together with four open-collector NPN outputs (only one open-collector output on 16-pin devices). These ports can also be used as input ports [one Analog-to Digital Converter (ADC) and three general purpose I/O ports (not available on 16-pin devices)]. An output is provided to control a Philips mixer/oscillator IC in combination with the PNP buffers state. Depending on the reference divider ratio (512, 640 or 1024), the phase comparator operates at 3.90625 kHz, 6.25 kHz or 7.8125 kHz with a 4 MHz crystal. The LOCK detector bit FL is set to logic 1 when the loop is locked and is read on the SDA line (status byte) during a read operation. crystal oscillator input frequency PNP band switch buffers output current NPN open-collector output current operating ambient temperature storage temperature (IC) note 1 CONDITIONS MIN. 4.5 VCC1 - - 64 - 25 - 28 - 26 - - - -20 -40 - 12 22 27 - - - - 4 20 20 - - TYP.
TSA5522
MAX. 5.5 13.5 30 32 1400 3 3 3 - 25 25 +85 +150
UNIT V V mA mA MHz dBm dBm dBm MHz mA mA C C
The ADC is available for digital AFC control. The ADC code is read during a read operation on the I2C-bus. The ADC input is combined with the port P6. In the TEST mode, this port is also used as a TEST output for fref and 1 f 2 div (see Table 4). I2C-bus format Five serial bytes (including address byte) are required to address the device, select the VCO frequency, program the ports, set the charge-pump current and the reference divider ratio. The device has three independent I2C-bus addresses selected by applying a specific voltage on AS input (see Table 3). The general address C2 is always valid.
1996 Jan 23
3
1996 Jan 23
PRESCALER DIVIDE-BY-8 11 CP 12 f div 15-BIT PROGRAMMABLE DIVIDER
BLOCK DIAGRAM
handbook, full pagewidth
Philips Semiconductors
RF1
2
RF2
3
V tune
AMP
28 DIVIDER 512/640/1024 CP RSA 15-BIT FREQUENCY REGISTER IN-LOCK DETECTOR LOGIC RSB T2,T1,T0
XTAL
XTAL OSCILLATOR
f ref
DIGITAL PHASE COMPARATOR CHARGE PUMP
POWER-ON RESET
SCL
17 LOCK
TSA5522
OS
1.4 GHz I2C-bus controlled synthesizer
SDA RSA,RSB
18
I2 C -BUS 1 5 7-BIT PORTS REGISTER 7-BIT CONTROL REGISTER VCC1 VEE
4
GATE T2,T1,T0 PNP BUFFERS BAND SWITCH 6 V CC2 P1 P6 P5 P0 P2 P4 P7 10 9 8 13 16 15 14
AS
19
TRANSCEIVER
ADC
COMPARATORS
4 BS
7
n.c.
MLD226
Product specification
TSA5522
Fig.1 Block diagram (SSOP20).
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
PINNING SYMBOL VCC1 RF1 RF2 BS VEE VCC2 n.c. P2 P1 P0 CP Vtune P6 P7 P5 P4 SCL SDA AS XTAL SO16 1 2 3 4 5 6 - 7 8 9 10 11 12 - - - 13 14 15 16 SSOP20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 voltage supply (+5 V) RF signal input 1 RF signal input 2 band switch output to mixer/oscillator drive ground voltage supply (+12 V) not connected PNP band switch buffer output 2 PNP band switch buffer output 1 PNP band switch buffer output 0 charge-pump output tuning voltage output NPN open-collector output/ADC input NPN open-collector output/comparator input NPN open-collector output/comparator input NPN open-collector output/comparator input serial clock input serial data input/output address selection input crystal oscillator input DESCRIPTION
TSA5522
handbook, halfpage handbook, halfpage
V CC1 RF1 RF2 BS V EE V CC2 n.c. P2 P1
1 2 3 4 5
20 XTAL 19 AS 18 SDA 17 SCL 16 P4
V CC1 1 RF1 2 RF2 3 BS 4
16 XTAL 15 AS 14 SDA 13 SCL
TSA5522T
V EE 5 V CC2 6 P2 7 P1 8
MLD225
TSA5522M
6 7 8 9 15 P5 14 P7 13 P6 12 V tune 11 CP
MLD230
12 P6 11 V tune 10 CP 9 PO
P0 10
Fig.2 Pin configuration (SO16).
Fig.3 Pin configuration (SSOP20).
1996 Jan 23
5
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
FUNCTIONAL DESCRIPTION The device is controlled via the two-wire For programming, there is one module address (7 bits) and the R/W bit for selecting the READ or the WRITE mode. I2C-bus mode WRITE MODE (R/W = 0); see Table 1 Data bytes can be sent to the device after the address transmission (first byte). Four data bytes are required to fully program the device. The bus transceiver has an auto-increment facility which permits the programming of the device within one single transmission (address + 4 data bytes). The device can also be partially programmed providing that the first data byte following the address is divider byte 1 (DB1) or control byte (CB). The bits in the data bytes are defined in Table 1. The first bit of the first data I2C-bus.
TSA5522
byte transmitted indicates whether frequency data (first bit = 0) or control and ports data (first bit = 1) will follow. Until an I2C-bus STOP command is sent by the controller, additional data bytes can be entered without the need to re-address the device. The frequency register is loaded after the 8th clock pulse of the second divider byte (DB2), the control register is loaded after the 8th clock pulse of the control byte (CB) and the ports register is loaded after the 8th clock pulse of the ports byte (PB). I2C-BUS ADDRESS SELECTION The module address contains programmable address bits (MA1 and MA0) which offer the possibility of having several synthesizers (up to 3) in one system by applying a specific voltage on the AS input. The relationship between MA1 and MA0 and the input voltage on the AS input is given in Table 3.
Table 1
I2C-bus data format BYTE MSB 1 0 N7 1 P7(1) 1 N14 N6 CP P6 0 N13 N5 T2 P5(1) DATA BYTE 0 N12 N4 T1 P4(1) 0 N11 N3 T0 X MA1 N10 N2 RSA P2 MA0 N9 N1 RSB P1 LSB 0 N8 N0 OS P0 COMMAND A A A A A
Address byte (ADB) Divider byte 1 (DB1) Divider byte 2 (DB2) Control byte (CB) Ports byte (PB) Note
1. Not available on 16-pin devices. Table 2 Description of Table 1 DESCRIPTION programmable address bits (see Table 3) programmable divider bits N = N14 x 214 + N13 x 213 + ... + N1 x 2 + N0 charge-pump current; CP = 0 = 50 A; CP = 1 = 250 A test bits (see Table 4). For normal operation T2 = 0; T1 = 0; T0 = 1 reference divider ratio select bits (see Table 5) tuning amplifier control bit; for normal operation OS = 0 and tuning voltage is ON; when OS = 1 tuning voltage is OFF (high impedance) PNP band switch buffers control bits NPN open collector control bits when Pn = 0 output n is OFF; when Pn = 1 output n is ON don't care
SYMBOL MA1, MA0 N14 to N0 CP T2 to T0 RSA, RSB OS P2 to P0 P7 to P4 X
1996 Jan 23
6
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
Table 3 Address selection MA1 0 0 1 1 MA2 0 1 0 1 READ MODE; R/W = 1 (see Table 7)
TSA5522
VOLTAGE APPLIED ON AS INPUT 0 to 0.1VCC1 Always valid 0.4VCC1 to 0.6VCC1 0.9VCC1 to VCC1 Table 4 T2 0 0 1 1 1 1 T1 0 1 1 1 0 0 Test bits T0 1 X 0 1 0 1
DEVICE OPERATION normal mode charge-pump is OFF charge-pump is sinking current charge-pump is sourcing current fref is available at LOCK output
1 f 2 div
is available at LOCK output
Data can be read from the device by setting the R/W bit to logic 1. After the slave address has been recognized, the device generates an acknowledge pulse and the first data byte (status byte) is transferred on the SDA line (MSB first). Data is valid on the SDA line during a HIGH level of the SCL clock signal. A second data byte can be read from the device if the microcontroller generates an acknowledge on the SDA line (master acknowledge). End of transmission will occur if no master acknowledge occurs. The device will then release the data line to allow the microcontroller to generate a STOP condition. When ports P4 to P7 are used as inputs, the corresponding bits must be logic 0 (high impedance state). The POR flag is set to logic 1 at power-on. The flag is reset when an end-of-data is detected by the device (end of a read sequence). Control of the loop is made possible with the in-lock flag (FL) which indicates when the loop is locked (FL = 1). The bits I2, to I0 represent the status of the I/O ports P7, P5 and P4 respectively. A logic 0 indicates a LOW level and a logic 1 indicates a HIGH level (see "Characteristics"). A built-in ADC is available at pin P6. This converter can be used to apply AFC information to the microcontroller from the IF section of the television. The relationship between the bits A2 to A0 is given in Table 8.
Table 5
Ratio select bits RSB 0 1 1 Band switch output levels P1 1 0 0 P0 0 0 1 VOLTAGE ON BS OUTPUT 0.25 V 0.4VCC1 0.8VCC1 PHILIPS M/O BAND band A band B band C REFERENCE DIVIDER 640 1024 512
RSA X 0 1 Table 6 P2 0 1 0 Table 7
READ data format BYTE MSB 1 POR(2) 1 FL(3) 0 I2(4) DATA BYTE 0 I1(4) 0 I0(4) MA1 A2(5) MA0 A1(5) LSB 1 A0(5) COMMAND A(1) -
Address byte (ADB) Status byte (SB) Notes 1. A = acknowledge.
2. POR = power-on-reset (POR = 1 at power-on). 3. FL = in-lock flag (FL = 1 when loop is locked). 4. I2 to I0 = digital levels for I/O ports P7, P5 and P4 respectively. 5. A2 to A0 = digital outputs of the 5-level ADC. 1996 Jan 23 7
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
Table 8 ADC levels A2 1 0 0 0 0 A1 0 1 1 0 0 A0 0 1 0 1 0
TSA5522
VOLTAGE APPLIED ON PORT P6(1) 0.6VCC1 to 13.5V 0.45VCC1 to 0.6VCC1 0.3VCC1 to 0.45VCC1 0.15VCC1 to 0.3VCC1 0 to 0.15VCC1 Note 1. Accuracy is 0.02VCC1.
LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134) SYMBOL VCC1 VCC2 Vi(RF) Vo(BS) Vo(PNP) Io(PNP) VNPN INPN Vo(CP) Vo(tune) Vi(SCL) Vi/o(SDA) Io(SDA) Vi(AS) Vi(xtal) Tstg Tj tsc HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling bipolar devices. Every pin withstands the ESD test in accordance with MIL-STD-883C category B (2000 V). Every pin withstands the ESD test in accordance with Philips Semiconductors Machine Model 0 , 200 pF (200 V). supply voltage +5 V supply voltage + 12 V prescaler input voltage band switch output voltage PNP band switch buffer output voltage PNP band switch buffers output current NPN open-collector output voltage NPN open-collector output current charge-pump output voltage output tuning voltage serial clock input voltage serial data input/output voltage serial data output current address selection input voltage crystal oscillator input voltage storage temperature range (IC) maximum junction temperature short circuit time; every pin to VCC1 or GND PARAMETER MIN. -0.3 -0.3 -0.3 -0.3 - 0.3 -1 -0.3 -1 -0.3 -0.3 -0.3 -0.3 -1 -0.3 -0.3 -40 - - 6.0 16 VCC1 VCC1 VCC2 25 16 25 VCC1 35 6.0 6.0 5 VCC1 VCC1 +150 +150 10 MAX V V V V V mA V mA V V V V mA V V C C s UNIT
1996 Jan 23
8
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
THERMAL CHARACTERISTICS SYMBOL Rth j-a SO16 SSOP20 PARAMETER thermal resistance from junction to ambient in free air 110 120 MAX
TSA5522
UNIT K/W K/W
CHARACTERISTICS VCC1 = 4.5 to 5.5 V; VCC2 = VCC1 to 13.2 V; Tamb = -20 to 85 C; unless otherwise specified; see note 1 SYMBOL VCC1 VCC2 ICC1 ICC2 fRF DR PARAMETER supply voltage (+5 V) supply voltage (+12 V) supply current supply current RF input frequency divider ratio 15-bit frequency word Rxtal = 25 to 300 One band switch buffer is ON; Isource = 20 mA CONDITIONS MIN. 4.5 VCC1 - - 64 256 - - 22 27 - - TYP. MAX 5.5 13.5 30 32 1400 32767 V V mA mA MHz MHz UNIT
Crystal oscillator fxtal Zxtal Prescaler Vi(RF) RF input level VCC1 = 4.5 to 5.5 V; see Fig.4; fi = 80 to 150 MHz VCC1 = 4.5 to 5.5 V; see Fig.4; fi = 150 to 1000 MHz VCC1 = 4.5 to 5.5 V; see Fig.4; fi = 1000 to 1400 MHz PNP band switch buffers outputs |ILO| Vo(sat) |ILO| Vo(sat) COL output leakage current output saturation voltage VCC2 = 13.5 V; Vo = 0 V Isource = 20 mA; note 1 VCC1 = 5.5 V; Vo = 13.5 V Isink = 20 mA; note 3 VOL = 13.5 V -10 - - - 0.2 - 0.2 - 0.5 A V A V nF -25 -28 -26 - - - 3 3 3 dB dB dB crystal oscillator input frequency 3.2 600 4 1200 4.48 - MHz
crystal oscillator input fi = 4 MHz impedance (absolute value)
NPN open-collector outputs P4, P5, P6 and P7; see note 2 output leakage current output saturation voltage allowed capacitive loading on output pins 10 0.5 10
Input ports P7, P5 and P4; see note 2 VIL VIH IIH(AS) 1996 Jan 23 LOW level input voltage HIGH level input voltage - 3 - 9 - - - 1.5 - V V A
AS input (Address Selection) HIGH level input current VAS = VCC1 50
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
TSA5522
SYMBOL IIL(AS) VIL VIH IIH IIL fclk
PARAMETER LOW level input current
CONDITIONS VAS = 0 V
MIN. -50 - 3.0 - - - - - -
TYP. -
MAX
UNIT A
SCL and SDA inputs LOW level input voltage HIGH level input voltage HIGH level input current LOW level input current input clock frequency VIH = 5.5 V; VCC1 = 0 V VIH = 5.5 V; VCC1 = 5.5 V VIL = 0 V; VCC1 = 5.5 V 1.5 5.5 10 10 - 400 V V A A A kHz A A
- - -10 - - - - 0.36VCC1 0.7VCC1 3.1 - - - -5 -
100 - -
SDA output (I2C bus mode) IILO Vo Vo(BS) output leakage current output voltage VO = 5.5 V Isink = 3 mA band A; Isource = 20 A band B; Isource = 20 A band C; Isource = 20 A band C; Isource = 50 A Charge-pump output CP IICPH IICPL Vo(CP) ILI(off) HIGH charge pump current (absolute value) LOW charge pump current (absolute value) output voltage off-state leakage current CP = 1 CP = 0 in-lock; Tamb = +25 C T2 = 0; T1 = 1 250 50 1.95 1 - - - - - - 15 A A V nA A V mV 10 0.4
BS output (M/O band selection) output voltage 0.25 0.4VCC1 0.8VCC1 - 0.5 0.9VCC1 - V V V 0.43VCC1 V
Tuning voltage output Vtune ILO(off) Vo Vripple(p-p) leakage current when switched-off output voltage when the loop is closed acceptable ripple voltage on VCC1 (peak-to-peak value) OS = 1; Vtune = 33 V 10 32.6 30
OS = 0; T2 = 0; T1 = 0; T0 = 1; 0.4 RL = 27 k ; Vtune = 33 V fripple = 300 Hz to 300 kHz -
Notes 1. A single PNP band switch buffer is ON. 2. P4, P5 and P7 I/O ports are not available in 16-pin package. In 20-pin package, when a port is active, the collector voltage must not exceed 6 V. 3. A single NPN open-collector output is ON.
1996 Jan 23
10
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
TSA5522
handbook, full pagewidth
12
MLD227
power (dBm) 0
12
24
36
48 0 200 400 600 800 1000 1200 1400 f i (MHz) 1600
Fig.4 Prescaler typical input sensitivity curve.
1996 Jan 23
11
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
INTERNAL PIN CONFIGURATION
TSA5522
handbook, full pagewidth
3 k V CC1 300 F VCC1 to presscaler divider V CC1 RF1 Vref AS V CC1 V CC1 RF2 V CC1 1 k
VCC1
XTAL
1 k AS
SDA
V CC1 V CC1 BS
1 k SCL
V CC1
V CC1 P4
V EE
VCC1
V CC1 P5
TSA5522
VCC2 VCC2 n.c. V CC1 V CC1
P7 P2
VCC2
V CC1 X4
V CC1 P6
P1
Vtune
control VCC2 V CC1 down P0 up CP
MLD228
Fig.5 Internal pin configuration.
1996 Jan 23
12
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
APPLICATION INFORMATION Tuning amplifier The tuning amplifier is capable of driving the varicap voltage without an external transistor. The tuning voltage output must be connected to an external load of 27 k which is connected to the tuning voltage supply rail. Figure 6 shows a possible loop filter. The component values depend on the oscillator characteristics and the selected reference frequency. Crystal oscillator
TSA5522
The crystal oscillator uses a 4 MHz crystal connected in series with an 18 pF capacitor thereby operating in the series resonance mode. Connecting the oscillator to the supply voltage is preferred, but it can, however, also be connected to ground.
handbook, full pagewidth
V tune 27 k 33 V UHF 39 nF P0 180 nF CP 22 k V tune P6 SCL SDA AS P6 SCL SDA AS XTAL VCC2 V EE BS 1 nF RF2 RF1 V CC1 1 nF 5V 10 nF
MLD229
P1 P2
VHF1 VHF3 12 V
TSA5522T
BS RF RF
4 MHz
18 pF
Fig.6 Typical application (SO16).
1996 Jan 23
13
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
Flock flag (FL) definition When the LOCK output is LOW the maximum frequency deviation (f) from stable frequency can be expressed as K VCO ( C1 + C2 ) follows: f = ------------- x I CP x ---------------------------( C1 x C2 ) KO where: Kvco = oscillator slope Hz/V ICP = charge-pump current (A) KO = 4 x 10E6 C1, C2 = loop filter capacitors. In the application: KVCO = 16 MHz/V (UHF band) ICP = 250 A C1 = 180 nF, C2 = 39 nF f = 31.2 kHz. Table 9 LOCK output / FL flag setting DESCRIPTION CONDITION MIN. 1024 2048 1280 0 Fig.7 Loop filter.
handbook, halfpage
TSA5522
C2 C1 R
MBE331
MAX. 1152 2304 1440 300
UNIT s s s s
Time span between actual phase lock and LOCK bit is LOW RSA = 1; RSB = 1 (or FL flag = 1) RSA = 1; RSB = 1 RSB = 0 Time span between the loop losing lock and LOCK bit is HIGH or (FL flag = 0)
1996 Jan 23
14
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm
TSA5522
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 0.24 0.23 L 1.05 0.041 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.0098 0.057 0.0039 0.049
0.019 0.0098 0.39 0.014 0.0075 0.38
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-23
1996 Jan 23
15
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
TSA5522
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A X
c y HE vM A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 90-04-05 95-02-25
1996 Jan 23
16
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering SO Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. SSOP
TSA5522
Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). METHOD (SO AND SSOP) During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Jan 23
17
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TSA5522
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1996 Jan 23
18
Philips Semiconductors
Product specification
1.4 GHz I2C-bus controlled synthesizer
NOTES
TSA5522
1996 Jan 23
19
Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40-2783749, Fax. (31)40-2788399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil, P.O. Box 7383 (01064-970), Tel. (011)821-2333, Fax. (011)829-1849 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (800) 234-7381, Fax. (708) 296-8556 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. (852)2319 7888, Fax. (852)2319 7700 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (45)32 88 26 36, Fax. (45)31 57 19 49 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (358)0-615 800, Fax. (358)0-61580 920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: P.O. Box 10 51 40, 20035 HAMBURG, Tel. (040)23 53 60, Fax. (040)23 53 63 00 Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)7640 000, Fax. (01)7640 200 Italy: PHILIPS SEMICONDUCTORS S.r.l., Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5130, Fax. (03)3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. (040)2783749, Fax. (040)2788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546 Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430, Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494 Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (66) 2 745-4090, Fax. (66) 2 398-0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 27 70, Fax. (0212)282 67 07 Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165, 252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991 United Kingdom: Philips Semiconductors LTD., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-2724825 SCDS47 (c) Philips Electronics N.V. 1996
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands

▲Up To Search▲

Price & Availability of TSA5522T

	To Download TSA5522T Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .